The self-assembled and film-forming processes of n-dodecyl mercaptan solution,t-dodecyl mercaptan solution and mixed solution of n- and t-dodecyl mercaptans on copper surface were investigated.The corrosion resistances of the self-assembled films formed in three kinds of solutions on copper surface using electrochemical techniques such as AC impedance and polarization curves,were tested.The connection between the quality of the self-assembled film of n-dodecyl mercaptan solution and concentration of the solution,and the assembly time were discussed.The results indicated that the self-assembled film formed in the mixed solution of n- and t-dodecyl mercaptans on copper surfaceshowed a much better advantage in both quality and corrosion resistance than that formed in only n- or t-dodecyl mercaptan solution.
关键词
正、叔十二烷基硫醇铜表面自组装膜
Keywords
n- and t-dodecyl mercaptancopper surfaceself-assembled films